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Titolo:
CHARACTERIZATION AND RELIABILITY OF TI NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES/
Autore:
SCANDURRA A; IPORTO A; MAMELI L; VISCUSO O; DELBO V; PIGNATARO S;
Indirizzi:
CONSORZIO CATANIA RIC,VIALE A DORIA 8 I-92125 CATANIA ITALY CO RIMME I-95100 CATANIA ITALY ST MICROELECTR MILAN ITALY UNIV CATANIA,DIPARTIMENTO SCI CHIM I-95125 CATANIA ITALY
Titolo Testata:
Surface and interface analysis
fascicolo: 1-12, volume: 22, anno: 1994,
pagine: 353 - 357
SICI:
0142-2421(1994)22:1-12<353:CAROTN>2.0.ZU;2-9
Fonte:
ISI
Lingua:
ENG
Soggetto:
MICROSTRUCTURAL EVOLUTION; SN ALLOYS; FATIGUE; SOLDER; OXIDATION;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Citazioni:
17
Recensione:
Indirizzi per estratti:
Citazione:
A. Scandurra et al., "CHARACTERIZATION AND RELIABILITY OF TI NI/AU, TI/NI/AG AND TI/NI BACK-SIDE METALLIZATIONS IN THE DIE-BONDING OF POWER ELECTRONIC DEVICES/", Surface and interface analysis, 22(1-12), 1994, pp. 353-357

Abstract

The surface compositions of three different back-side metals: Ti/Ni/Au 0.1/0.4/0.1 mum, Ti/Ni/Ag 0.1/0.4/0.1 and 0.1/0.4/2 mum and Ti/Ni 0.1/0.4 mum after thermal treatment at 180-degrees-C in air were investigated by means of XPS technique. In the Ti/Ni/Au metal the Ni diffusion through the Au layer was observed, while in the Ti/Ni/Ag metal Ni was not found on the silver surface. Ti/Ni/Ag was found to be sensitive to contamination from elements such as sulphur and chlorine found on the silver surface after thermal treatment, while Ti/Ni metal is sensitive to oxidation. NiO, Ni(OH)2, NiOOH and Ni2O3 species were found on the Ni as deposited surface. The surface compositions were correlated to their wetting property using the Pb88-Sn10-Ag2 and Pb95.5-Sn2-Ag2.5wt% soft solder alloys. The wetting was studied measuring the contactangle between the surface and the drop of molten solders.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 21/09/20 alle ore 14:59:59