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Titolo:
AN OVERVIEW AND EVALUATION OF ANISOTROPICALLY CONDUCTIVE ADHESIVE FILMS FOR FINE-PITCH ELECTRONIC ASSEMBLY
Autore:
CHANG DD; CRAWFORD PA; FULTON JA; MCBRIDE R; SCHMIDT MB; SINITSKI RE; WONG CP;
Indirizzi:
AT&T BELL LABS,ENGN RES CTR,DEPT ENVIRONM & MAT TECHNOL PRINCETON NJ 08542 AT&T BELL LABS,ENGN RES CTR,DEPT ASSEMBLY TECHNOL,TECH STAFF PRINCETON NJ 08542 AT&T BELL LABS,ENGN RES CTR,ASSEMBLY TECHNOL GRP,TECH STAFF PRINCETONNJ 08542
Titolo Testata:
IEEE transactions on components, hybrids, and manufacturing technology
fascicolo: 8, volume: 16, anno: 1993,
pagine: 828 - 835
SICI:
0148-6411(1993)16:8<828:AOAEOA>2.0.ZU;2-V
Fonte:
ISI
Lingua:
ENG
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
4
Recensione:
Indirizzi per estratti:
Citazione:
D.D. Chang et al., "AN OVERVIEW AND EVALUATION OF ANISOTROPICALLY CONDUCTIVE ADHESIVE FILMS FOR FINE-PITCH ELECTRONIC ASSEMBLY", IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 828-835

Abstract

Conductive adhesives have been used in the electronics industry for several years to attach chips to package lead frames in the semiconductor industry and for general interconnection of components to flexible circuits for various consumer products. Generally, these materials conduct equally in all directions. To obtain pad isolation, the adhesivesare screen printed to the pattern of the circuit pads. In the last few years, a new class of adhesives that are conductive in a single direction have been developed. These are referred to as anisotropic conductive adhesive films (ACAF's). These anisotropically conductive adhesives provide electrical as well as mechanical interconnections for fine pitch applications. The conductivity of ACAF materials is only in the Z-direction (perpendicular to the plane of the board) while electricalisolation is maintained in the X - Y plane. Currently, at least 15 ACAF materials are commercially available. We have developed a methodology for evaluating these materials for their mechanical and electrical properties and interconnection use in the 8 to 15 mil pitch range. In addition, we characterized the materials according to their physical properties and cure characteristics. This paper details our findings with a comparison of physical form to assembly/cure and final electricalproperties. We include in this study data from scanning electron microscopy, thermal analysis of the ACAF's, and cure and assembly studies on mixed substrate test vehicles. Information on initial electrical testing and long-term reliability testing is also given.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 01/12/20 alle ore 10:51:22