Catalogo Articoli (Spogli Riviste)

OPAC HELP

Titolo:
DEVELOPMENT OF A PIXEL READOUT CHIP COMPATIBLE WITH LARGE-AREA COVERAGE
Autore:
CAMPBELL M; ANTINORI F; BEKER H; BEUSCH W; CHESI E; HEIJNE EHM; HEUSER J; JARRON P; KARTTAAVI T; KRUMMENACHER F; LOPEZ L; MEDDELER G; MENETREY A; MIDDELKAMP P; NEYER C; PENGG F; PINDO M; QUERCIGH E; SIMONE S; VERWEIJ H;
Indirizzi:
CERN CH-1211 GENEVA 23 SWITZERLAND UNIV GESAMTHSCH W-5600 WUPPERTAL GERMANY INFN ROME ITALY UNIV ROMA LA SAPIENZA I-00185 ROME ITALY SMART SILICON SYST LAUSANNE SWITZERLAND SWISS FED INST TECHNOL CH-8092 ZURICH SWITZERLAND INFN MILAN ITALY INFN BARI ITALY UNIV MILAN I-20122 MILAN ITALY UNIV BARI I-70124 BARI ITALY
Titolo Testata:
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment
fascicolo: 1, volume: 342, anno: 1994,
pagine: 52 - 58
SICI:
0168-9002(1994)342:1<52:DOAPRC>2.0.ZU;2-B
Fonte:
ISI
Lingua:
ENG
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
5
Recensione:
Indirizzi per estratti:
Citazione:
M. Campbell et al., "DEVELOPMENT OF A PIXEL READOUT CHIP COMPATIBLE WITH LARGE-AREA COVERAGE", Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 342(1), 1994, pp. 52-58

Abstract

A second version of the Omega pixel readout chip has been developed in order to make it compatible with large area coverage. Specific features of the new chip include a reset which can be applied immediately following a ''false'' trigger, an improved minimum strobe time of approximately 100 ns, a readout clock rate of approximately 20 MHz and tri-state buffers on the output data lines. The excellent performance figures of the first chip for noise (100 e- rms without detector and 170 e- rms with detector) and power consumption (30 muW/pixel) have been maintained. We demonstrate how with solder bump-bonding we can create hybrid ''ladders'' which hermetically cover an area of approximately 5 mm X 50 mm. Potential problems of electrical matching and yield have been addressed and procedures are in place for selecting only ''good'' readout chips for mounting.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 05/12/20 alle ore 02:01:39