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Titolo:
SIMS MICROPROFILES OF PB-5-PERCENT-SN SOLDER JOINTS IN ELECTRONIC DEVICES AFTER ACCELERATED LIFE TESTS
Autore:
SCANDURRA A; PORTO A; PUGLISI O;
Indirizzi:
UNIV CATANIA,DIPARTIMENTO SCI CHIM,VIALE A DORIA 6 I-95125 CATANIA ITALY UNIV CATANIA,DIPARTIMENTO SCI CHIM I-95125 CATANIA ITALY CONSORZIO RIC MICROELETTRON & MEZZOGIORNO I-95100 CATANIA ITALY CONSORIO CATANIA RIC I-95125 CATANIA ITALY
Titolo Testata:
Applied surface science
fascicolo: 1, volume: 89, anno: 1995,
pagine: 1 - 10
SICI:
0169-4332(1995)89:1<1:SMOPSJ>2.0.ZU;2-8
Fonte:
ISI
Lingua:
ENG
Soggetto:
PB-SN ALLOYS; MICROSTRUCTURAL EVOLUTION; THERMOMECHANICAL FATIGUE; OXIDATION; TIN;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
21
Recensione:
Indirizzi per estratti:
Citazione:
A. Scandurra et al., "SIMS MICROPROFILES OF PB-5-PERCENT-SN SOLDER JOINTS IN ELECTRONIC DEVICES AFTER ACCELERATED LIFE TESTS", Applied surface science, 89(1), 1995, pp. 1-10

Abstract

The failure mechanisms of Pb-5%Sn (wt%) solder alloy in electronic devices assembled in a plastic package have been investigated. For this purpose dice with Al/Ni/Au4/1.0/0.05 mu m thick and Ti/Ni/Au0.1/0.4/0.05 mu m thick back side metals were prepared. Retrospective SIMS (Secondary Ion Mass Spectrometry) microprofiles obtained in fracture surfaces of the solder layer after thermal cycles, suggest two failure mechanisms. One is based on the formation of regions of the alloy where theSn concentration is lower than the average. This depletion appears tobe due to coupling between defect fluxes and material fluxes in the alloy during thermomechanical fatigue. An additional cause that resultsin degradation of the alloy is the oxidation of the solder layer. Theoxygen source appears to be oxygen species present in the metal layers that diffuse into the alloy during the thermal cycling test.

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Documento generato il 21/09/20 alle ore 15:24:02