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Titolo:
PREENCAPSULATION CLEANING METHODS AND CONTROL FOR MICROELECTRONICS PACKAGING
Autore:
WONG CP; MCBRIDE R;
Indirizzi:
AT&T BELL LABS,TECH STAFF PRINCETON NJ 08542
Titolo Testata:
IEEE transactions on components, packaging, and manufacturing technology. Part A
fascicolo: 4, volume: 17, anno: 1994,
pagine: 542 - 552
SICI:
1070-9886(1994)17:4<542:PCMACF>2.0.ZU;2-#
Fonte:
ISI
Lingua:
ENG
Soggetto:
ENCAPSULANT;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
11
Recensione:
Indirizzi per estratti:
Citazione:
C.P. Wong e R. Mcbride, "PREENCAPSULATION CLEANING METHODS AND CONTROL FOR MICROELECTRONICS PACKAGING", IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(4), 1994, pp. 542-552

Abstract

A modern electronic device is a complex three-dimensional structure that consists of millions of components on each single IC chip. Such a device requires effective cleaning to ensure its long-term reliability, In order to achieve reliability without hermeticity with these IC devices, various organic (silicones, epoxies, polyimides, etc.) and inorganic (silicon oxides, silicon nitrides, etc.) coating materials are used for protection. However, packaging contaminated IC devices guarantees device failure, and preencapsulation cleaning methods and controlsare the most critical process steps in determining the reliability ofthe packaged IC devices. We have prepared well-controlled substrates (such as SiO2, SiN, SiON) for our cleaning experiments and have developed a series of cleaning processes that achieve the best cleaning results prior to encapsulation. These cleaning processes consist of both chlorofluoro hydrocarbon (CFC) and non-CFC solutions including (d-limonene), isopropanol, new surfactants, high purity, deionized water (DI H2O), peroxide (H2O2), etc. Furthermore, we have demonstrated that contact angle measurements in a 100% RH environment are simple, fast, and reliable in detecting the substrate surface cleanliness, particularly with respect to hydrocarbon contamination on the first similar to 10 angstroms of surface layers. ESCA and contact angle measurement analyses are also used to quantify and correlate the cleaning processes. Results of these processes are given in this report.

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Documento generato il 04/12/20 alle ore 16:33:30