Catalogo Articoli (Spogli Riviste)

OPAC HELP

Titolo:
NEAR ATOMIC-SCALE STUDIES OF ELECTRONIC-STRUCTURE AT GRAIN-BOUNDARIESIN NI3AL
Autore:
MULLER DA; SUBRAMANIAN S; BATSON PE; SASS SL; SILCOX J;
Indirizzi:
CORNELL UNIV,SCH APPL & ENGN PHYS ITHACA NY 14853 CORNELL UNIV,DEPT MAT SCI & ENGN ITHACA NY 14853 IBM CORP,THOMAS J WATSON RES CTR YORKTOWN HTS NY 10598
Titolo Testata:
Physical review letters
fascicolo: 26, volume: 75, anno: 1995,
pagine: 4744 - 4747
SICI:
0031-9007(1995)75:26<4744:NASOEA>2.0.ZU;2-Q
Fonte:
ISI
Lingua:
ENG
Soggetto:
COHESIVE PROPERTIES; DOPED NI3AL; WHITE LINES; BORON; ALLOYS; RESOLUTION; METALS; HEATS; NI;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Citazioni:
35
Recensione:
Indirizzi per estratti:
Citazione:
D.A. Muller et al., "NEAR ATOMIC-SCALE STUDIES OF ELECTRONIC-STRUCTURE AT GRAIN-BOUNDARIESIN NI3AL", Physical review letters, 75(26), 1995, pp. 4744-4747

Abstract

Why does boron doping improve the room temperature ductility of polycrystalline Ni3Al? Besides preventing environmental embrittlement, B changes the fracture mode from intergranular to transgranular, suggesting an increase in the cohesive strength of the grain boundaries. This change in bonding at the grain boundary has been measured using spatially resolved electron energy loss spectroscopy. The Ni L(2,3) core edge, which is sensitive to the filling of the Ni d band, shows that only the B-rich regions of the grain boundary have a bonding similar to that of the bulk material. These changes suggest a simple model to describe the cohesion of the boundary.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 25/11/20 alle ore 07:04:49