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Titolo:
AN OBJECT-ORIENTED BLACKBOARD BASED APPROACH FOR AUTOMATED FINITE-ELEMENT MODELING AND ANALYSIS OF MULTICHIP MODULES
Autore:
SHEEHY M; GROSSE IR;
Indirizzi:
UNIV MASSACHUSETTS,ENGN LAB BLDG,BOX 32210 AMHERST MA 01003 UNIV MASSACHUSETTS AMHERST MA 01003
Titolo Testata:
Engineering with computers
fascicolo: 4, volume: 13, anno: 1997,
pagine: 197 - 210
SICI:
0177-0667(1997)13:4<197:AOBBAF>2.0.ZU;2-F
Fonte:
ISI
Lingua:
ENG
Keywords:
BLACKBOARD SYSTEMS; FINITE ELEMENT SYSTEMS; MULTICHIP MODULES; OBJECT-ORIENTED;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
CompuMath Citation Index
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
16
Recensione:
Indirizzi per estratti:
Citazione:
M. Sheehy e I.R. Grosse, "AN OBJECT-ORIENTED BLACKBOARD BASED APPROACH FOR AUTOMATED FINITE-ELEMENT MODELING AND ANALYSIS OF MULTICHIP MODULES", Engineering with computers, 13(4), 1997, pp. 197-210

Abstract

This paper addresses the application of the blackboard system architecture and object-oriented data abstraction techniques to the domain offinite element modeling and analysis. Specifically, a hierarchical object-oriented database was used to represent the physical system at different levels of abstraction including the user-defined physical system level, a computer-generated, simplified physical model level, and the finite element model level. Object link relationships within a given abstraction level and across different abstraction levels resulted in seamless bidirectional information exchange. The blackboard system architecture employed provided a framework for distributed cooperative problem solving, for the application of simplifying domain-specific modeling assumptions, and for integrating the various software modules that are involved in the entire finite element modeling and analysis process. These methodologies were implemented in a prototype computational tool called IMCMA -the Intelligent Multichip Module Analyzer. An example illustrates how IMCMA automates finite element thermal analysis of small integrated circuit features in multichip modules through a two-step finite element submodeling process.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 29/11/20 alle ore 06:52:42