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1. Lee, YH; Park, J; Kim, S
   Experimental study on input and bottleneck scheduling for a semiconductor fabrication line
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   Y.H. Lee et al., "Experimental study on input and bottleneck scheduling for a semiconductor fabrication line", IIE TRANS, 34(2), 2002, pp. 179-190
2. Ni, J; Coldiron, SJ; Zhong, CJ; Porter, MD
   Electrochemically-actuated mercury valve for flow rate and direction control: design, characterization, and applications
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3. Chiang, KN; Yuan, CA
   An overview of solder bump shape prediction algorithms with validations
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4. Larson, DJ; Wissman, BD; Martens, RL; Viellieux, RJ; Kelly, TF; Gribb, TT; Erskine, HF; Tabat, N
   Advances in atom probe specimen fabrication from planar multilayer thin film structures
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5. Olivier, M; Rochat, N; Chabli, A; Lefeuvre, G; Conne, F
   Multiple internal reflection spectroscopy: a sensitive non-destructive probe for interfaces and nanometric layers
   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
   
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6. Huth, S; Breitenstein, O; Lambert, U; Huber, A
   Imaging of the lateral GOI-defect distribution in silicon MOS wafers with lock-in IR-thermography
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7. Lee, DK; Hwang, DH; Lee, SH; Mun, YH; Lee, BY; Yoo, HD
   The study on the radial distribution of delta [Oi] in heavily doped Si wafer using X-ray diffraction
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8. Rousseau, K; Rouviere, JL; Fournel, F; Moriceau, H
   Structural characterization of ultra-thin (001) silicon films bonded onto (001) silicon wafers: a transmission electron microscopy study
   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
   
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9. Fastenau, JM; Liu, WK; Fang, XM; Lubyshev, DI; Pelzel, RI; Yurasits, TR; Stewart, TR; Lee, JH; Li, SS; Tidrow, MZ
   Commercial production of QWIP wafers by molecular beam epitaxy
   INFRARED PHYSICS & TECHNOLOGY
   
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10. Park, CB; Hong, SM; Jung, JP; Kang, CS; Shin, YE
    A study on the fluxless soldering of Si-wafer/glass substrate using Sn-3.5mass%Ag and Sn-37 mass%Pb solder
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    C.B. Park et al., "A study on the fluxless soldering of Si-wafer/glass substrate using Sn-3.5mass%Ag and Sn-37 mass%Pb solder", MATER TRANS, 42(5), 2001, pp. 820-824
11. Shen, SC; Pan, CT; Chou, HP; Chou, MC
    Batch assembly micro-ball lens array for Si-based optical coupling platform in free space
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12. Masi, M
    Multiscale approach to material synthesis by gas phase deposition
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13. Sato, T; Yokoyama, H; Ohya, H; Kamada, H
    Imaging of electrically detected magnetic resonance of a silicon wafer
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    T. Sato et al., "Imaging of electrically detected magnetic resonance of a silicon wafer", J MAGN RES, 153(1), 2001, pp. 113-116
14. Karim, A; Piprek, J; Abraham, P; Lofgreen, D; Chiu, YJ; Bowers, JE
    1.55-mu m vertical-cavity laser arrays for wavelength-division multiplexing
    IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
    
    A. Karim et al., "1.55-mu m vertical-cavity laser arrays for wavelength-division multiplexing", IEEE S T QU, 7(2), 2001, pp. 178-183
15. Yang, TH; Su, CT; Feng, YC
    In search of a product mix for semiconductor wafer fabrication facilities by a combined simulation/neural network approach
    INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING-THEORY APPLICATIONS AND PRACTICE
    
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16. Lin, CA; Jan, YK
    Control system design for a rapid thermal processing system
    IEEE TRANSACTIONS ON CONTROL SYSTEMS TECHNOLOGY
    
    C.A. Lin e Y.K. Jan, "Control system design for a rapid thermal processing system", IEEE CON SY, 9(1), 2001, pp. 122-129
17. Rusu, C; van't Oever, R; de Boer, MJ; Jansen, HV; Berenschot, JW; Bennink, ML; Kanger, JS; de Grooth, BG; Elwenspoek, M; Greve, J; Brugger, J; van den Berg, A
    Direct integration of micromachined pipettes in a flow channel for single DNA molecule study by optical tweezers
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    C. Rusu et al., "Direct integration of micromachined pipettes in a flow channel for single DNA molecule study by optical tweezers", J MICROEL S, 10(2), 2001, pp. 238-246
18. Bishop, WL; Summers, DM; Lichtenberger, AW
    Precision techniques for whole wafer dicing and thinning of superconducting mixer circuits
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
    
    W.L. Bishop et al., "Precision techniques for whole wafer dicing and thinning of superconducting mixer circuits", IEEE APPL S, 11(1), 2001, pp. 171-174
19. Lee, JM; Watkins, KG; Steen, WM
    Surface cleaning of silicon wafer by laser sparking
    JOURNAL OF LASER APPLICATIONS
    
    J.M. Lee et al., "Surface cleaning of silicon wafer by laser sparking", J LASER APP, 13(4), 2001, pp. 154-158
20. Kumar, S; Kumar, PR
    Queueing network models in the design and analysis of semiconductor wafer fabs
    IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION
    
    S. Kumar e P.R. Kumar, "Queueing network models in the design and analysis of semiconductor wafer fabs", IEEE ROBOT, 17(5), 2001, pp. 548-561
21. Jeng, MD; Xie, XL
    Modeling and analysis of semiconductor manufacturing systems with degradedbehavior using Petri nets and siphons
    IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION
    
    M.D. Jeng e X.L. Xie, "Modeling and analysis of semiconductor manufacturing systems with degradedbehavior using Petri nets and siphons", IEEE ROBOT, 17(5), 2001, pp. 576-588
22. Kim, YD; Kim, JG; Kim, HU
    Production scheduling in a semiconductor wafer fabrication facility producing multiple product types with distinct due dates
    IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION
    
    Y.D. Kim et al., "Production scheduling in a semiconductor wafer fabrication facility producing multiple product types with distinct due dates", IEEE ROBOT, 17(5), 2001, pp. 589-598
23. Hsieh, BW; Chen, CH; Chang, SC
    Scheduling semiconductor wafer fabrication by using ordinal optimization-based simulation
    IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION
    
    B.W. Hsieh et al., "Scheduling semiconductor wafer fabrication by using ordinal optimization-based simulation", IEEE ROBOT, 17(5), 2001, pp. 599-608
24. Chen, JH; Fu, LC; Lin, MH; Huang, AC
    Petri-net and GA-based approach to modeling, scheduling, and performance evaluation for wafer fabrication
    IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION
    
    J.H. Chen et al., "Petri-net and GA-based approach to modeling, scheduling, and performance evaluation for wafer fabrication", IEEE ROBOT, 17(5), 2001, pp. 619-636
25. Ohiso, Y; Okamoto, H; Iga, R; Kishi, K; Tateno, K; Amano, C
    High performance of 1.55-mu m buried-heterostructure vertical-cavity surface-emitting lasers
    IEEE PHOTONICS TECHNOLOGY LETTERS
    
    Y. Ohiso et al., "High performance of 1.55-mu m buried-heterostructure vertical-cavity surface-emitting lasers", IEEE PHOTON, 13(9), 2001, pp. 918-920
26. Raburn, M; Liu, B; Okuno, Y; Bowers, JE
    InP-InGaAsP wafer-bonded vertically coupled X-crossing multiple channel optical add-drop multiplexer
    IEEE PHOTONICS TECHNOLOGY LETTERS
    
    M. Raburn et al., "InP-InGaAsP wafer-bonded vertically coupled X-crossing multiple channel optical add-drop multiplexer", IEEE PHOTON, 13(6), 2001, pp. 579-581
27. Lin, CK; Dapkus, PD
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    IEEE PHOTONICS TECHNOLOGY LETTERS
    
    C.K. Lin e P.D. Dapkus, "Uniform wafer-bonded oxide-confined bottom-emitting 850-nm VCSEL arrays onsapphire substrates", IEEE PHOTON, 13(4), 2001, pp. 263-265
28. Black, KA; Bjorlin, ES; Piprek, J; Hu, EL; Bowers, JE
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    IEEE PHOTONICS TECHNOLOGY LETTERS
    
    K.A. Black et al., "Small-signal frequency response of long-wavelength vertical-cavity lasers", IEEE PHOTON, 13(10), 2001, pp. 1049-1051
29. Wang, DG; Zhang, SW; Gao, ML
    Nano-scratch study of molecular deposition (MD) films on silicon wafer using nanoindentation
    SCIENCE IN CHINA SERIES A-MATHEMATICS PHYSICS ASTRONOMY
    
    D.G. Wang et al., "Nano-scratch study of molecular deposition (MD) films on silicon wafer using nanoindentation", SCI CHINA A, 44, 2001, pp. 326-329
30. Wang, TK; Wang, MY; Ko, FH; Tseng, CL
    Characterization and modeling of the metal diffusion from deep ultravioletphotoresist and silicon-based substrate
    APPLIED RADIATION AND ISOTOPES
    
    T.K. Wang et al., "Characterization and modeling of the metal diffusion from deep ultravioletphotoresist and silicon-based substrate", APPL RAD IS, 54(5), 2001, pp. 811-820
31. Jonsson, K; Kohler, J; Hedlund, C; Stenmark, L
    Oxygen plasma wafer bonding evaluated by the Weibull fracture probability method
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING
    
    K. Jonsson et al., "Oxygen plasma wafer bonding evaluated by the Weibull fracture probability method", J MICROM M, 11(4), 2001, pp. 364-370
32. Lee, JH; You, SJ; Park, SC
    A new intelligent SOFM-based sampling plan for advanced process control
    EXPERT SYSTEMS WITH APPLICATIONS
    
    J.H. Lee et al., "A new intelligent SOFM-based sampling plan for advanced process control", EXPER SY AP, 20(2), 2001, pp. 133-151
33. Karabaliev, M; Kochev, V
    Probing the "interfacial" and "bulk" characteristics of solid-supported thin liquid films
    MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS
    
    M. Karabaliev e V. Kochev, "Probing the "interfacial" and "bulk" characteristics of solid-supported thin liquid films", MAT SCI E C, 14(1-2), 2001, pp. 11-16
34. Ohtsuka, H; Sakamoto, M; Koyama, M; Muramatsu, S; Yazawa, Y; Warabisako, T; Abe, T; Saitoh, T
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    SOLAR ENERGY MATERIALS AND SOLAR CELLS
    
    H. Ohtsuka et al., "Effect of light degradation on bifacial Si solar cells", SOL EN MAT, 66(1-4), 2001, pp. 51-59
35. Kerst, U; Muller, B; Nell, ME; Wagemann, HG
    Monolithic series-interconnection for a thin film silicon solar cell
    SOLAR ENERGY MATERIALS AND SOLAR CELLS
    
    U. Kerst et al., "Monolithic series-interconnection for a thin film silicon solar cell", SOL EN MAT, 65(1-4), 2001, pp. 471-476
36. Tachibana, T; Ando, Y; Watanabe, A; Nishibayashi, Y; Kobashi, K; Hirao, T; Oura, K
    Diamond films grown by a 60-kW microwave plasma chemical vapor deposition system
    DIAMOND AND RELATED MATERIALS
    
    T. Tachibana et al., "Diamond films grown by a 60-kW microwave plasma chemical vapor deposition system", DIAM RELAT, 10(9-10), 2001, pp. 1569-1572
37. Kobayashi, K; Suzuki, H
    A sampling mechanism employing the phase transition of a gel and its application to a micro analysis system imitating a mosquito
    SENSORS AND ACTUATORS B-CHEMICAL
    
    K. Kobayashi e H. Suzuki, "A sampling mechanism employing the phase transition of a gel and its application to a micro analysis system imitating a mosquito", SENS ACTU-B, 80(1), 2001, pp. 1-8
38. Seyama, M; Sugimoto, I; Katoh, T
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    SENSORS AND ACTUATORS B-CHEMICAL
    
    M. Seyama et al., "An exchangeable Si wafer internal reflection element for FT-IR measurementof water sample", SENS ACTU-B, 74(1-3), 2001, pp. 54-59
39. Calvo, V; Sotta, D; Ulmer, H; Hadji, E; Magnea, N; Dumont, F; Moriceau, H; Hernandez, C; Campidelli, Y
    Luminescence of silicon thin film and SiGe multiple quantum wells realizedon SOI
    OPTICAL MATERIALS
    
    V. Calvo et al., "Luminescence of silicon thin film and SiGe multiple quantum wells realizedon SOI", OPT MATER, 17(1-2), 2001, pp. 107-110
40. Wild, MJ; Gillner, A; Poprawe, R
    Locally selective bonding of silicon and glass with laser
    SENSORS AND ACTUATORS A-PHYSICAL
    
    M.J. Wild et al., "Locally selective bonding of silicon and glass with laser", SENS ACTU-A, 93(1), 2001, pp. 63-69
41. Weinert, A; Amirfeiz, P; Bengtsson, S
    Plasma assisted room temperature bonding for MST
    SENSORS AND ACTUATORS A-PHYSICAL
    
    A. Weinert et al., "Plasma assisted room temperature bonding for MST", SENS ACTU-A, 92(1-3), 2001, pp. 214-222
42. Niklaus, F; Andersson, H; Enoksson, P; Stemme, G
    Low temperature full wafer adhesive bonding of structured wafers
    SENSORS AND ACTUATORS A-PHYSICAL
    
    F. Niklaus et al., "Low temperature full wafer adhesive bonding of structured wafers", SENS ACTU-A, 92(1-3), 2001, pp. 235-241
43. Chiao, M; Lin, LW
    Hermetic wafer bonding based on rapid thermal processing
    SENSORS AND ACTUATORS A-PHYSICAL
    
    M. Chiao e L.W. Lin, "Hermetic wafer bonding based on rapid thermal processing", SENS ACTU-A, 91(3), 2001, pp. 398-402
44. Tan, CM; Yeo, KNC
    A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT)
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS
    
    C.M. Tan e K.N.C. Yeo, "A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT)", J ELEC TEST, 17(1), 2001, pp. 63-68
45. Tong, QY
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    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    
    Q.Y. Tong, "Wafer bonding for integrated materials", MAT SCI E B, 87(3), 2001, pp. 323-328
46. Pasquariello, D; Camacho, M; Hjort, K; Dozsa, L; Szentpali, B
    Evaluation of InP-to-silicon heterobonding
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    
    D. Pasquariello et al., "Evaluation of InP-to-silicon heterobonding", MAT SCI E B, 80(1-3), 2001, pp. 134-137
47. Yasunaga, M; Yoshihara, I; Kim, JH
    The evolutionary algorithm-based reasoning system
    IEICE TRANSACTIONS ON INFORMATION AND SYSTEMS
    
    M. Yasunaga et al., "The evolutionary algorithm-based reasoning system", IEICE T INF, E84D(11), 2001, pp. 1508-1520
48. Nakai, I; Terada, Y; Itou, M; Sakurai, Y
    Use of highly energetic (116 keV) synchrotron radiation for X-ray fluorescence analysis of trace rare-earth and heavy elements
    JOURNAL OF SYNCHROTRON RADIATION
    
    I. Nakai et al., "Use of highly energetic (116 keV) synchrotron radiation for X-ray fluorescence analysis of trace rare-earth and heavy elements", J SYNCHROTR, 8, 2001, pp. 1078-1081
49. Suzuki, E; Matsuda, H; Chiba, T; Mori, A
    New microcharacters for wafer identification
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
    
    E. Suzuki et al., "New microcharacters for wafer identification", IEEE SEMIC, 14(3), 2001, pp. 180-186
50. Shan, L; Zhou, CH; Danyluk, S
    Mechanical interactions and their effects on chemical mechanical polishing
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
    
    L. Shan et al., "Mechanical interactions and their effects on chemical mechanical polishing", IEEE SEMIC, 14(3), 2001, pp. 207-213
51. Acharya, N; Kirtikar, V; Shooshtarian, S; Doan, H; Timans, PJ; Balakrishnan, KS; Knutson, KL
    Uniformity optimization techniques for rapid thermal processing systems
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
    
    N. Acharya et al., "Uniformity optimization techniques for rapid thermal processing systems", IEEE SEMIC, 14(3), 2001, pp. 218-226
52. Lin, S; Chu, HS
    Thermal uniformity of 12-in silicon wafer in linearly ramped-temperature transient rapid thermal processing
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
    
    S. Lin e H.S. Chu, "Thermal uniformity of 12-in silicon wafer in linearly ramped-temperature transient rapid thermal processing", IEEE SEMIC, 14(2), 2001, pp. 143-151
53. Chien, CF; Hsu, SC; Deng, JF
    A cutting algorithm for optimizing the wafer exposure pattern
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    C.F. Chien et al., "A cutting algorithm for optimizing the wafer exposure pattern", IEEE SEMIC, 14(2), 2001, pp. 157-162
54. Pahk, HJ; Ahn, WJ
    A new method of noncontact measurement for 3D micro pattern in semiconductor wafer: implementing a new optical probe
    INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
    
    H.J. Pahk e W.J. Ahn, "A new method of noncontact measurement for 3D micro pattern in semiconductor wafer: implementing a new optical probe", INT J MACH, 41(13-14), 2001, pp. 2031-2037
55. Noda, S
    Two- and three-dimensional photonic crystals in III-V semiconductors
    MRS BULLETIN
    
    S. Noda, "Two- and three-dimensional photonic crystals in III-V semiconductors", MRS BULL, 26(8), 2001, pp. 618-621
56. Liu, ZX; DeVoe, DL
    Micromechanism fabrication using silicon fusion bonding
    ROBOTICS AND COMPUTER-INTEGRATED MANUFACTURING
    
    Z.X. Liu e D.L. DeVoe, "Micromechanism fabrication using silicon fusion bonding", ROBOT CIM, 17(1-2), 2001, pp. 131-137
57. Takenaka, M; Yamada, Y; Yabuki, M; Nakamura, S; Kozuka, S
    Determination of the ultratrace metallic impurities distribution in silicon wafers by sub-area chemical etching/microflow neblizer-ICP-MS
    BUNSEKI KAGAKU
    
    M. Takenaka et al., "Determination of the ultratrace metallic impurities distribution in silicon wafers by sub-area chemical etching/microflow neblizer-ICP-MS", BUNSEKI KAG, 50(6), 2001, pp. 399-404
58. Yamada, Y; Tachibe, T; Shimazaki, A; Takanaka, M; Kozuka, S
    Determination of ultratrace phosphorus and titanium on silicon wafer surface by high resolution ICP-MS
    BUNSEKI KAGAKU
    
    Y. Yamada et al., "Determination of ultratrace phosphorus and titanium on silicon wafer surface by high resolution ICP-MS", BUNSEKI KAG, 50(6), 2001, pp. 453-458
59. Kondo, K; Sekiya, Y; Fukui, K; Tanaka, Z
    Shape evolution of high aspect ratio copper bumps used for wafer level CSP
    KAGAKU KOGAKU RONBUNSHU
    
    K. Kondo et al., "Shape evolution of high aspect ratio copper bumps used for wafer level CSP", KAG KOG RON, 27(4), 2001, pp. 484-486
60. Lu, SY; Tong, HS; Chen, WC; Liu, TJ
    Reduction of ultra-pure water usage in wafer rinsing process via sequential compensatory strategies
    JOURNAL OF THE CHINESE INSTITUTE OF CHEMICAL ENGINEERS
    
    S.Y. Lu et al., "Reduction of ultra-pure water usage in wafer rinsing process via sequential compensatory strategies", J CH INST C, 32(2), 2001, pp. 117-124
61. Horng, RH; Wuu, DS; Seieh, CH; Peng, WC; Huang, MF; Tsai, SJ; Liu, JS
    Wafer bonding of 50-mm-diameter mirror substrates to AlGaInP light-emitting diode wafers
    JOURNAL OF ELECTRONIC MATERIALS
    
    R.H. Horng et al., "Wafer bonding of 50-mm-diameter mirror substrates to AlGaInP light-emitting diode wafers", J ELEC MAT, 30(8), 2001, pp. 907-910
62. Yun, CH; Cheung, NW
    Thermal and mechanical separations of silicon layers from hydrogen pattern-implanted wafers
    JOURNAL OF ELECTRONIC MATERIALS
    
    C.H. Yun e N.W. Cheung, "Thermal and mechanical separations of silicon layers from hydrogen pattern-implanted wafers", J ELEC MAT, 30(8), 2001, pp. 960-964
63. Vilela, MF; Anselm, KA; Sooriar, N; Johnson, JL; Lin, CH; Brown, GJ; Mahalingam, K; Saxler, A; Szmulowicz, F
    InAs/InGaSb photodetectors grown on GaAs bonded substrates
    JOURNAL OF ELECTRONIC MATERIALS
    
    M.F. Vilela et al., "InAs/InGaSb photodetectors grown on GaAs bonded substrates", J ELEC MAT, 30(7), 2001, pp. 798-801
64. Moran, PD; Kuech, TF
    Kinetics of strain relaxation in semiconductor films grown on borosilicateglass-bonded substrates
    JOURNAL OF ELECTRONIC MATERIALS
    
    P.D. Moran e T.F. Kuech, "Kinetics of strain relaxation in semiconductor films grown on borosilicateglass-bonded substrates", J ELEC MAT, 30(7), 2001, pp. 802-806
65. Friedland, KJ; Riedel, A; Kostial, H; Horicke, M; Hey, R; Ploog, KH
    High mobility electron heterostructure wafer fused onto LiNbO3
    JOURNAL OF ELECTRONIC MATERIALS
    
    K.J. Friedland et al., "High mobility electron heterostructure wafer fused onto LiNbO3", J ELEC MAT, 30(7), 2001, pp. 817-820
66. Aspar, B; Moriceau, H; Jalaguier, E; Lagahe, C; Soubie, A; Biasse, B; Papon, AM; Claverie, A; Grisolia, J; Benassayag, G; Letertre, F; Rayssac, O; Barge, T; Maleville, C; Ghyselen, B
    The generic nature of the Smart-Cut((R)) process for thin film transfer
    JOURNAL OF ELECTRONIC MATERIALS
    
    B. Aspar et al., "The generic nature of the Smart-Cut((R)) process for thin film transfer", J ELEC MAT, 30(7), 2001, pp. 834-840
67. Colinge, C; Roberds, B; Doyle, B
    Silicon layer transfer using wafer bonding and debonding
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    C. Colinge et al., "Silicon layer transfer using wafer bonding and debonding", J ELEC MAT, 30(7), 2001, pp. 841-844
68. Chen, KN; Fan, A; Reif, R
    Microstructure examination of copper wafer bonding
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    K.N. Chen et al., "Microstructure examination of copper wafer bonding", J ELEC MAT, 30(4), 2001, pp. 331-335
69. Fu, GH; Chandra, A
    A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation
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    G.H. Fu e A. Chandra, "A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation", J ELEC MAT, 30(4), 2001, pp. 400-408
70. Quitoriano, N; Wong, WS; Tsakalakos, L; Cho, Y; Sands, T
    Kinetics of the Pd/In thin-film bilaver reaction: Implications for transient-liquid-phase wafer bonding
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    N. Quitoriano et al., "Kinetics of the Pd/In thin-film bilaver reaction: Implications for transient-liquid-phase wafer bonding", J ELEC MAT, 30(11), 2001, pp. 1471-1475
71. Dabbas, RM; Chen, HN; Fowler, JW; Shunk, D
    A combined dispatching criteria approach to scheduling semiconductor manufacturing systems
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    R.M. Dabbas et al., "A combined dispatching criteria approach to scheduling semiconductor manufacturing systems", COM IND ENG, 39(3-4), 2001, pp. 307-324
72. Paraskevopoulos, A; Hensel, HJ; Schelhase, S; Frahm, J; Kubler, J; Denker, A; Gubenko, A; Portnoi, EL
    'On-wafer' surface implanted high power, picosecond pulse InGaAsP/InP (lambda=1.53-1.55 mu m) laser diodes
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    A. Paraskevopoulos et al., "'On-wafer' surface implanted high power, picosecond pulse InGaAsP/InP (lambda=1.53-1.55 mu m) laser diodes", OPT QUANT E, 33(7-10), 2001, pp. 745-750
73. Dessein, K; Kumar, PSA; Lagae, L; De Boeck, J; Delaey, L; Borghs, G
    Improvement of the transfer coefficient of GaAs/Si spin-valve transistors
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    K. Dessein et al., "Improvement of the transfer coefficient of GaAs/Si spin-valve transistors", J MAGN MAGN, 226, 2001, pp. 2081-2083
74. Sreejith, PS; Udupa, G; Noor, YBM; Ngoi, BKA
    Recent advances in machining of silicon wafers for semiconductor applications
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
    
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75. Deepak; Gaur, A
    Role of temperature gradients in blanket tungsten for microelectronic contacts
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY
    
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76. So, JH; Bae, SH; Yang, SM; Kim, DH
    Preparations of silica slurry for wafer polishing via controlled growth ofcommercial silica seeds
    KOREAN JOURNAL OF CHEMICAL ENGINEERING
    
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77. Chung, HY; Kim, KS; Cho, HY; Lee, BY; Yoo, HD; Lee, SH
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    KOREAN JOURNAL OF CHEMICAL ENGINEERING
    
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78. Chae, HB; Park, H; Hong, JS; Han, YJ; Joo, Y; Baik, YJ; Lee, JK; Lee, SW
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    INTERNATIONAL JOURNAL OF THERMOPHYSICS
    
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79. Suzuki, T
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    APPLIED SURFACE SCIENCE
    
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80. Akimoto, T; Arai, S; Hara, K; Nakayama, T; Ikegami, Y; Iwata, Y; Kobayashi, H; Kohriki, T; Kondo, T; Nakano, I; Ohsugi, T; Shimojima, M; Shinma, S; Takashima, R; Terada, S; Ujiie, N; Unno, Y; Yamamoto, K; Yamamura, K
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    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT
    
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81. Tsoukalas, D; Skarlatos, D; Stoemenos, J
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    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
    
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82. Bromberg, LE; Buxton, DK; Friden, PM
    Novel periodontal drug delivery system for treatment of periodontitis
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83. Hall, S; Lamb, AC; Bain, M; Armstrong, BM; Gamble, H; El Mubarek, HAW; Ashburn, P
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84. Lagnado, I; de la Houssaye, PR
    Integration of Si and SiGe with Al2O3 (sapphire)
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85. Une, A; Kai, Y; Mochida, M; Matsui, S
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86. Kaesmaier, R; Ehrmann, A; Loschner, H
    Ion projection lithography: status of tool and mask developments
    MICROELECTRONIC ENGINEERING
    
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87. Damm, C; Peschel, T; Risse, S; Kirschstein, UC
    Wafer stage assembly for ion projection lithography
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88. Beckert, E; Hoffmann, A; Saffert, E
    Development of a vertical wafer stage for high-vacuum applications
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89. Bensahel, D; Vandelle, B; Morin, C; Martins, J; Galvier, J; Vialletelle, P; Henry, M
    Front-end, single-wafer diffusion processing for advanced 300-mm fabrication lines
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90. Imai, M; Mayusumi, M; Inoue, K; Nakahara, S; Gima, S
    Issues for the larger diameter epitaxial wafer
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91. Fischer, A; Richter, H; Shalynin, A; Krottenthaler, P; Obermeier, G; Lambert, U; Wahlich, R
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92. Wang, J; Tu, H; Zhou, Q; Zhu, W; Liu, A
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    MICROELECTRONIC ENGINEERING
    
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93. Shin, NS; Chang, CH; Koo, YM; Padmore, H
    Synchrotron radiation excited total reflection X-ray fluorescence quantitative analysis of Si wafer by absolute fluorescence intensity calculation
    MATERIALS LETTERS
    
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94. Dabbas, RM; Chen, HN
    Mining semiconductor manufacturing data for productivity improvement - an integrated relational database approach
    COMPUTERS IN INDUSTRY
    
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95. Haedrich, RL; Merrett, NR; O'Dea, NR
    Can ecological knowledge catch up with deep-water fishing? a North Atlantic perspective
    FISHERIES RESEARCH
    
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96. Choi, BJ; Sreenivasan, SV; Johnson, S; Colburn, M; Wilson, CG
    Design of orientation stages for step and flash imprint lithography
    PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISIONENGINEERING AND NANOTECHNOLOGY
    
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97. Kersten, H; Deutsch, H; Steffen, H; Kroesen, GMW; Hippler, R
    The energy balance at substrate surfaces during plasma processing
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98. Karasawa, M; Masuda, A; Ishibashi, K; Matsumura, H
    Development of Cat-CVD apparatus - a method to control wafer temperatures under thermal influence of heated catalyzer
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99. Werner, JH; Dassow, R; Rinke, TJ; Kohler, JR; Bergmann, RB
    From polycrystalline to single crystalline silicon on glass
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100. Johansson, M; Berg, J; Bengtsson, S
     High frequency properties of silicon-on-insulator and novel depleted silicon materials
     SOLID-STATE ELECTRONICS
     
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